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Your search returned 7 records. Click on the hyperlinks to view further details of Titles.. |
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Magazine Name : Ieee Transactions On Components, Packaging, And Manufacturing Technology Part-B: Advanced Packaging
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Year : 1994 Volume number : 17 Issue: 01 |
Restraint Effects In Laser Welding Of An Aluminum Mmc
(Article)
Subject:
Metal Matrix Composites
,
Joint Decoding
,
Electronic Packaging
Author:
P. W.
Fuerschbach
M. J.
Cieslak
page:
108
-
114
Delay And Reflection Noise Macromodeling For Signal Integrity Management Of Pcbs And Mcms
(Article)
Subject:
Delay Analysis
,
Mcm
,
Management
Author:
Slobodan
Simovich
Paul
Frazon
Michael
Steer
page:
15
-
21
Transiednt Simulation Of Frequency-Dependent Monuniform Coupled Lossy Transmission Lines
(Article)
Subject:
Vlsi Interconnects
,
Nonuniformity
,
Generalized Multiprotocol Label Switching/Multi Protocol Label Switching
Author:
Fung-Yuel
Chang
page:
3
-
14
Cad-Based Net Capacitance Testing Of Unpopulated Mcm Substrates
(Article)
Subject:
Multiple Channels
,
Testing
,
Capacitance
,
Cad
Author:
J. S
Marshall
F. C.
Chong
S.
Westbrook
page:
50
-
55
Electrical Test Of Multichip Substrates
(Article)
Subject:
Electrical Motor
,
Multichip Module
,
Latent Heat
Author:
Laertis
Economikos
Thomas
Morrison
page:
56
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61
Electron-Beam Mcm Testing And Probing
(Article)
Subject:
Electroceramics
,
Probing Technique
Author:
Marcus
Brunner
R.
Schmid
O.
Gessner
page:
62
-
68
Automated Design Tool For Examining Mictoelectonic Packagin Desugbn Altermatives
(Article)
Subject:
Electronic Packaging
,
Finite Element Analysis
,
Nonlinear
Author:
Siew-Wei
Chin
Subramaniam D.
Rajan
Krishnaswamy
Nagaraj
page:
76
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82
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